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Microspectrophotometer-MSP-DUV-Vis-NIR

Microspectrophotometer and Film Thickness Tool MSP100

Microspectrophotometer (Micro-Photometer, Micro Spectrophotometer) is used to characterize optical properties of thin films, thick coatings over a micron region area. Microspectrophotometer is also called micro-reflectometer, micro-spectrometer, microphotometer micro-spectroscopic photometer etc. With unique design by Angstrom's professionals, user can enjoy digital imaging capability in Microspectrophotometers (MSP series) by live video, powerful digital editing, measurement tools for reflection, transmission, absorption spectra. Data acquisition only takes milliseconds. TFProbe software allows user to set up heating stage or cooling stage for kinetic study in real time for optical property changes such as reflectance, transmittance, coating thickness, refractive index (optical constants) etc. Automatic mapping function is also available in various Microspectrophotometer models with motorized X-Y stage or Rho-Theta Stage, plus a motorized focus function. Wavelength range usually is an important factor for user to consider. Angstrom's microspectrophotometer covers from deep-ultraviolet (DUV) to near-infrared (NIR) ranges. Which range should be considered will depend on several factors such as what thickness ranges for thin film or thick coating are, what typical wavelength range of interest for reflectance or transmittance spectra is, and so on. Microspectrophotometers have been used in various fields, like in nano fab, forensic, medical, MEMS, MEOMS, biological, chemistry etc...

Angstrom Sun Technologies Inc offers three standard configurations for microspectrophotometer. MSP100 covers from 250 to 1000nm (DUV-Vis). A DUV-Vis full range objective will come with system. MSP300 has a wavelength range of 400 to 1000nm for visible reflection or transmission spectra measurement. MSP300 is suitable for thick film thickness measurements. MSP500 covers from DUV to NIR full range (250-1700nm). Other wavelength ranges or functions can be customized to meet your application.

 
Features:
  • Advanced optics and rugged design for highest uptime and the best system performance
  • Array based detector system to ensure fast measurement
  • Affordable, portable and small footprint table top design
  • Measure film thickness and Refractive Index up to 5 layers over micron size region
  • Allow to acquire reflection, transmission and absorption spectra in milliseconds
  • Capable to be used for real time spectra, thickness, refractive index monitoring
  • System comes with comprehensive optical constants database and library
  • Advanced Software allows user to use either NK table, dispersion or composite model (EMA) for each individual film
  • Integrated Vision, spectrum, simulation, film thickness measurement system
  • Apply to many different type of substrates with different thickness and different sizes
  • Deep ultraviolet light allows to measure ultra thin film thickness and their band gaps
  • 2D and 3D output graphics for mapping functions and user friendly data management interface
  • Advanced Imaging software for dimension measurement such as angle, distance, area, particle counting and more
  • Various options available to meet special applications
System Configuration:

Model

Wavelength Range

Measurable

Parameters

Measurable

Thickness Range

Spot Size

Options

MSP100

250 to 1000 nm

D - Thickness;

R - Reflection

T - Transmission

N - Refractive Index;

K - Extinction Coefficients

Geometry of features

Up to 25um

Configuration 1:

8µm /40µm /100µm

 

Or

 

Configuration 2:

5µm /25µm /50µm 

 

Transmission

Motorized Stage

Motorized Z Focus

Heating/Cooling Stage

Special Sample Holders

Fluorescence Attachment

Other spot sizes
Various Filters

Polarizing optics

Thickness standards

MSP300

400 to 1000 nm

20nm to 50um

MSP400

1000 to 1700 nm

50nm to 50um

MSP450

400 to 1700 nm

20nm to 50um

MSP500

250 to 1700 nm

Up to 50um
  • Communication: USB
  • Measurement Type: Reflection/Transmission spectra, Film thickness/refractive index and feature dimensions
  • Computer: Intel i3 Processor with 500GB Hard drive and DVD+RW Burner plus 22” LCD Monitor or better with request
  • Power: 110– 240 VAC /50-60Hz, 3 A
  • Dimension: 16’x16’x18’ (Table top setup)
  • Weight: 120 lbs total
  • Warranty: One year labor and parts
Specifications:
  • Wavelength range: configurable per request and application
  • Wavelength Resolution: 1nm typical
  • Substrate Size: up to 20mm thick
  • Measurable thickness range*: 20Å to 50 µm
  • Measurement Time: 2 ms minimum
  • Accuracy*: better than 0.5% (comparing with ellipsometry results for Thermal Oxide sample by using the same optical constants)
  • Repeatability*: < 2 Å (1 sigma from 50 thickness readings for 1500 Å Thermal SiO2 on Si Wafer)
Options:
  • Wavelength extension to other range
  • Higher power optics for smaller spot size
  • Customized configuration for special applications
  • Heating and Cooling Stage for kinetics study
  • Other stage size holding samples up to 300mm
  • Higher wavelength range resolution down to 0.1nm
  • Various filters for special applications
  • Add-on accessories for fluorescence measurement
  • Add-on accessories for polarizing applications
  • MSP setup with wafer handler automation
  • Simple, low cost version is available (MSP-Eco)
Applications:
  • Semiconductor fabrication (PR, Oxide, Nitride..)
  • Liquid crystal display (ITO, PR, Cell gap…..)
  • Forensics, Biological films and materials
  • Inks, Mineralogy, Pigments, Toners
  • Pharmaceuticals, Medial Devices
  • Optical coatings, TiO2, SiO2, Ta2O5…..
  • Semiconductor compounds
  • Functional films in MEMS/MOEMS
  • Amorphous, nano and crystalline Si
  • Hard coatings on PET
Interface Example:

Example Setup 1 (MSP300 with manual stage)

 

Example Setup 2 (MSP500)

Example Setup 3 (MSP450)

Example Setup 4 (MSP300 with Wafer Loader Automation)

Application Examples:
 

  • Measured Transmission Spectra of Three Filters with Microspectrophotometer MSP100

  • Measured Reflection Spectrum over a MEMS Mirror with Microspectrophotometer MSP100

  • Mapped Thickness Uniformity over 4" wafer with Microspectrophotometer MSP100

  • Measured Transmission Spectra for Color Pixels with Microspectrophotometer MSP300

  • Measured Film Thickness of TiO2 on Silicon with Microspectrophotometer MSP300

  • Measured Reflection Spectra over a MEMS Device Inside/Outside a Via-hole with Microspectrophotometer MSP300

  • Digital Imaging Function in MSP300 System with Microspectrophotometer MSP300

Note:

  • System configuration and Specifications subject to change without notice
  • * Film property, surface quality and layer stack dependent
  • Customized system available for special applications
  • TFProbe is registered trademark of Angstrom Sun Technologies Inc.