• Great performance at low cost
• Modular design, easy to set up, virtually no maintenance required
• Easy to operate with Window based software
• Non-contact, non-destructive, ultra-long working distance
• Compact, Advanced optics design for best system performance
• Long Lifetime light Source (over 8 years)
• Array based detector system to ensure fast measurement
• Application types: wafer warp, wafer bow, wafer thickness, wafer thickness variation (TTV), glass wafer thickness, trench depth, bump height, air gaps sandwiched between two transparent plates and more,
• Capable to be used for real time or in-line monitoring
• System comes with comprehensive optical constants database and library
• Integrable with spectroscopic ellipsometer or reflectometer for thin film measurements on all different type of wafers
• Apply to many different types and sizes of substrates
• TFProbe software allows to various scanning patterns, linear, square, non-square, polar, user-defined….
• 2D and 3D output graphics and user-friendly data management interface

• Model: TFProbe WMxxx
• Light Source: over 8 years Long Lifetime Source
• Spectrometer: 2048-pixel detector
• Motorized Stage: 2” to 12” range selectable
• Precision Z stage with tilting adjustment
• Three-point ball support for wafers to free standing
• Sample Plate: up to 300mm size with pins for various sizes of wafers
• Communication: USB
• Computer: Intel i3 processor, 8GB ram and 500GB Hard Drive with Keyboard and Mouse
• Monitor: 22” LCD Monitor
• Software: TFProbe 3.3
• Power input: World-wide, universal 110– 240 VAC /50-60Hz, 1.5 A

Note: system will be configured per quote to meet applications.

• Dual heads for non-transparent substrate property measurement
• Small spot for measuring trench depth
• In-Situ or in-line Integration and Processing Monitoring
• Multiple Heads for simultaneously measurement at multiple locations for step or bump heights
• Mapping uniformity for non regular wafer size samples
• Simple, low cost one spot measurement setup without motorized stages

1. Flatness/Warpage /Displacement for non-transparent Wafers
2. Flatness/Warpage /Displacement for transparent Wafers on its top surface
3. Flatness/Warpage /Displacement for transparent Wafers on its bottom surface
4. Thickness of transparent Wafers
5. Gap Thickness between two transparent wafers/Layers
6. Step Height with two sensor heads
7. Non-transparent wafer thickness with two sensor heads

• One head for transparent wafer (Glass, SiC, Sapphire, Quartz, PET sheet….) thickness
• One head for wafer displacement variation, Bow, warp measurements
• One head for step/bump height, trench depth measurement via motorized stage scanning
• One head for gap thickness measurement between two glass plates
• Two heads for non-transparent wafer or plate thickness measurement (Si, InP, GaAs, Ge…)
• Two heads for step/bump/trench depth measurement without motorized stage
• In-Situ or in-line Integration and Processing Monitoring

Real Time Running Display:

1. 300mm Silicon Wafers:

2. 200mm silicon Wafer with thin films on it

3. Unpolished 200mm Silicon Wafers:

4. 200mm Glass Wafers

5. 6” Metal Wafers:

Output Examples

1. Step Height and Profile of Surface Features

2. 200mm Glass Wafers (500um Thickness)

3. 200mm Glass Wafers (700um Thickness)